

The dispensing system deposits solder paste on a substrate with a dispensing nozzle.
For dense circuits with a tight tolerance, the X-Y position and height of the nozzle has to be accurate and the volume of jet solder has to be stable regardless of the amount of remaining glue in the syringe.
To maintain high productivity, not only the high throughput, but also minimalthe minimized downtime and change-overs are essential.
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