Vacuum process
In the vacuum process, also called plasma process (PE-CVD or sputtering), the wafer is coated with anti-reflection film (SiN) in the vacuum chambers. For optimized deposition of SiN layers, a comprehensive optimization of process parameters is required. This can improve the module efficiency. To ensure safe and stable operation, the integrity of sensing is essential.
Related Applications
The variety of surface conditions on a wafer makes stable wafer detection difficult. Some thin-films (like...
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During the cell/module production process, the wafer cassettes are managed centrally and locally. In the case of...
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The specifications of each machine have to be designed for each production line, so the structure of a machine...
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Safe operation is always a key issue. The interlock system protects operator and system from unsafe conditions....
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Placing sensors in a vacuum chamber is problematic because the haze that develops on view ports or lenses on...
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To place sensors in lamination chambers they have to be resistant to temperature, vacuum and atmospheric pressure.
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When cell breakage or string parallelism is inspected, the various surface colours and shapes make it difficult to...
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