Wafer-thickness measurement
Challenge
To measure the thickness of a wafer, the distance from both sides is measured with two laser sensors.
The variability of the surface conditions makes it difficult to measure this distance.
Solution
Omron offers laser measurement solutions with direct reflection.
The dedicated algorithm, optical method and the shape of the beam enables the gap to be measured with better resolution.
Benefit
Precise and fast measurement enables yield and throughput improvement.
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