Wafer polishing
Wafer surface is polished to a mirror finish in order to minimize chipping and cracking, and enable the formation of the circuit pattern.
Related Applications
To measure the thickness of a wafer, the distance from both sides is measured with two laser sensors.
The...
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In thermal processes, safe operation is also a key issue. The interlock system protects operator and system from...
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When you detect the level of liquid in a transparent tube, bubbles, drops or mucous liquid may cause detection...
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To detect the presence of wafers in a wafer carrier correctly, the opening angle of through beam has to be narrow...
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To centralize the wafer or search for the notch position, the edge position has to be measured accurately and...
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