Wafer mapping
Challenge
To detect the presence of wafers in a wafer carrier correctly, the opening angle of through beam has to be narrow because of the unexpected reflection caused in the FOUP.
Adjustment of the tilt of the narrow beam is difficult to achieve mechanically.
Solution
Omron offers fiber heads with a narrow beam (opening angle 1.5 degree) in which the tilt can be adjusted easily. The mounting reference-plane-based optical axis is already adjusted during the assembly, and the displacement is typically within 0.1 of a degree.
Benefit
Saves mapping-sensor adjustment time and offers stable mapping for high-yields.
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Challenge
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