Wafer probing process
Each die on a wafer is electrically tested automatically, using a wafer-probing system.
A wafer is fixed on a stable platform and a set of precision pointed needles on designated probe pad are dropped onto each die. The probe pad is connected to automatic test equipment.
Related Applications
To detect the presence of wafers in a wafer carrier correctly, the opening angle of through beam has to be narrow...
>>
To centralize the wafer or search for the notch position, the edge position has to be measured accurately and...
>>
For 300 mm FOUP management, faulty reading of the carrier ID causes manufacturing-line stoppage. The...
>>
Detecting FOUP cassettes on load port with an optical sensor is made difficult by the variety in color, surface...
>>
