CMP
CMP (chemical/mechanical planarization) is used over a wide range in the treatment for rendering the wafer surface flat during various steps in the production.
Related Applications
The variety of surface conditions on wafers makes stable wafer detection difficult. Some thin-films on wafers...
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Safe operation is always a key issue. The interlock system protects operator and system from unsafe conditions....
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To detect the presence of wafers in a wafer carrier correctly, the opening angle of through beam has to be narrow...
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To centralize the wafer or search for the notch position, the edge position has to be measured accurately and...
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Mechanical sensors can cause damage to the glass/wafer. On the other hand, it is difficult to detect glass/wafer...
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Leakage of a liquid can cause a serious hazard, such as giving an electric shock, or exposing operators to...
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When you detect the level of liquid in a transparent tube, bubbles, drops or mucous liquid may cause detection...
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