X-ray inspection

X-Ray inspection is being used in various front- and back-end processes during Semiconductor production. An example is the post-bonding inspection, right after 'Flip Chip' die bonding. During this inspection the contacts of the 'bumped' chip with the contactpoints of the substrates (i.e. PCB, Ceramics, Leadframe, ....) are checked for short-circuiting. Given the principle of 'Flip Chip' bonding (the chip is being turned and placed upside down) the actual contacts are not visible after mounting. Short-circuits and faulty connections can only be recognized by X-Ray.