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Dispensing

The dispensing system deposits epoxy on substrate with a dispensing nozzle.
Accurate positioning of the nozzle with a programmed pattern and tightly controlled pressure for precise epoxy volume are required.

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Linear slider X/Y dispenser table

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Wafer Preparation
Crystal silicon growth
Slicing the ingot
Wafer polishing
Front End
Photolithography
Vacuum process
Wet process
Thermal process
CMP
Wafer bumping
Wafer probing process
Wafer transfer
Back End
Dicing
Dispensing
Die bonding
X-ray inspection
Wire bonding
IC molding
IC trim & form
IC testing