Bonding head with linear motor

Challenge

Normally a pick & place unit is used for die-bonding. For productivity reasons, it makes sense to preposition every wafer before it is taken by the pick & place unit, in which case precision prepositioning becomes essential.

Solution

The use of Omron’s linear motors enables the construction of a rigid and compact X/Y table with the required specifications regarding positioning characteristics and cycle times.

Benefits

The compact construction combined with the dynamics and precision of Omron linear servo systems enables space saving and higher productivity.