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Die bonding

Diced chips are connected to lead frames at a die-bonding machine. Various chips are assembled accurately and quickly in this process. The high productivity and throughput of the machines is key in this process.

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Bonding head with linear motor

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Wafer Preparation
Crystal silicon growth
Slicing the ingot
Wafer polishing
Front End
Photolithography
Vacuum process
Wet process
Thermal process
CMP
Wafer bumping
Wafer probing process
Wafer transfer
Back End
Dicing
Dispensing
Die bonding
X-ray inspection
Wire bonding
IC molding
IC trim & form
IC testing