Gap measurement between wafer and blade/laser head

Challenge

Precise wafer dicing using precision diamond blade or lasers requires measurement of the vertical distance to the wafer surface.

Solution

Omron offers laser measurement solutions for both the blade diameter with through-beam type and distance-to-wafer with direct reflective type.

With the specific algorithm optical method and beam shape of beam gap, measurement can be made with improved resolution.

Benefit

Precise measurement enables yield improvement and saves maintenance time.