Dicing
In the dicing process, the undersurface of the wafer is polished. Then it’s diced into individual chips by cutting a checkerboard pattern.
Dicing/grinding is one of the most critical processes for maintaining a good yield.
The cutting line and depth has to be defined before dicing, checking the distance between the edge of blade and wafer.
In view of the potential hazards, the machine must be controlled to prevent accidents from occurring.
Related Applications
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