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Height measurement to IC chip
Challenge
A defective seal can occur if the volume of flux/glue is not correct and process failure causes massively defective products. However, the various surface conditions on devices make inspection difficult.
Solution
Omron offers laser displacement sensors to detect whether the height to the IC is correct. The distance to the dies can be measured with better resolution due to the measuring algorithm, optical method and the shape of the sensing spot.
Benefit
Defective products are prevented.
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